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INTERNATIONAL PATENT: QUALICAPS CO., LTD., クオリカプス株式会社 FILES APPLICATION FOR "BAND SEAL, BAND SEALING SOLUTION, METHOD FOR SEALING HARD CAPSULE AND HARD CAPSULE PRODUCT"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- QUALICAPS CO., LTD. (321-5, Ikezawa-cho, Yamatokoriyama-shi, Nara6391032), クオリカプス株式会社 (奈良県&... Read More

INTERNATIONAL PATENT: C4U CORPORATION, Ｃ４Ｕ株式会社, THE UNIVERSITY OF TOKYO, 国立大学法人東京大学, RIKEN, 国立研究開発法人理化学研究所 FILES APPLICATION FOR "GUIDE RNA AND USE THEREOF"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- C4U CORPORATION (Techno-Alliance Building C 7th floor, Osaka Univ., 2-8, Yamadaoka, Suita-shi, Osaka5650871), Ｃ４Ｕ株式会社 (大&#3844... Read More

INTERNATIONAL PATENT: U-MAP CO., LTD., 株式会社Ｕ－ＭＡＰ FILES APPLICATION FOR "HEAT DISSIPATION FILLER, RESIN COMPOSITION AND RESIN MOLDED BODY"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- U-MAP CO., LTD. (1003, Cresto Motoyama, 1-29, Honami-cho, Chikusa-ku, Nagoya-shi, Aichi4640822), 株式会社Ｕ－ＭＡＰ (愛&#3... Read More

INTERNATIONAL PATENT: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., パナソニックＩＰマネジメント株式会社 FILES APPLICATION FOR "RESIN COMPOSITION FOR OPTICAL WAVEGUIDE AND DRY FILM AND OPTICAL WAVEGUIDE USING SAID RESIN COMPOSITION"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (22-6, Moto-machi, Kadoma-shi, Osaka5710057), パナソニックＩＰマネ&#1... Read More

INTERNATIONAL PATENT: TOSOH CORPORATION, 東ソー株式会社 FILES APPLICATION FOR "ETCHING COMPOSITION"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- TOSOH CORPORATION (4560, Kaisei-cho, Shunan-shi, Yamaguchi7468501), 東ソー株式会社 (山口県周南市開... Read More

INTERNATIONAL PATENT: DENKA COMPANY LIMITED, デンカ株式会社 FILES APPLICATION FOR "METHOD FOR PRODUCING BIOCOMPATIBLE MATERIAL AND BIOCOMPATIBLE MATERIAL"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央&#... Read More

INTERNATIONAL PATENT: MITSUBISHI GAS CHEMICAL COMPANY, INC., 三菱瓦斯化学株式会社 FILES APPLICATION FOR "ETCHING LIQUID AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE USING SAME"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- MITSUBISHI GAS CHEMICAL COMPANY, INC. (5-2, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008324), 三菱瓦斯化学株式会社 (東&... Read More

INTERNATIONAL PATENT: EUREKA TECH INNOVATIONS CO.,LTD., 株式会社ＥＵＲＥＫＡ　ＴＥＣＨ　ＩＮＮＯＶＡＴＩＯＮＳ FILES APPLICATION FOR "WIRE FIXTURE"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- EUREKA TECH INNOVATIONS CO.,LTD. (1-7-5, Tedukayama, Abeno-ku Osaka-shi, Osaka5450037), 株式会社Ｅｕｒｅｋａ　&#6533... Read More

INTERNATIONAL PATENT: MITSUBISHI ELECTRIC CORPORATION, 三菱電機株式会社 FILES APPLICATION FOR "MOLDED ARTICLE, AIR CONDITIONER AND METHOD FOR PRODUCING MOLDED ARTICLE"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- MITSUBISHI ELECTRIC CORPORATION (7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008310), 三菱電機株式会社 (東京都&#21315... Read More

INTERNATIONAL PATENT: MITSUBISHI CHEMICAL CORPORATION, 三菱ケミカル株式会社 FILES APPLICATION FOR "RESIN COMPOSITION, RESIN COMPOSITION FOR RECOVERY AID, USE IN RECOVERY AID, REGRIND LAYER, MULTILAYER STRUCTURE, PACKAGE, FOOD PACKAGE, RECOVERY AID AND METHOD FOR PRODUCING REGRIND LAYER"

Posted On: 2025-02-04
Government News US Fed News

GENEVA, Feb. 4 -- MITSUBISHI CHEMICAL CORPORATION (1-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008251), 三菱ケミカル株式会社 (東&#20140... Read More